產品描述

Features

• Unique pressure and temperature uniformity
• Compatible with EVG mechanical and optical aligners
• Flexible design and configurations for research and piloting
  • Form single chips to wafers
  • Various processes (eutectic, solder, TLP, direct bonding)
  • Optional turbopump (<1E-5 mbar)
  • Upgradeable for anodic bonding
  • Open chamber design for easy conversion and maintenance
• Production compatible
  • High throughput with fast heating and pumping specifications
  • High yield through automatic wedge compensation
  • Open chamber design for fast conversion and maintenance
  • Smallest footprint for a 200 mm bonding system: 0.8 m2
  • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Technical Data