1. 产品目录

晶圆临时键合机解键合机

晶圆临时键合机解键合机

型号︰EVG®850 TB DB

品牌︰EVG

原产地︰奥地利

单价︰EUR € 6000000 / 件

最少订量︰1 件

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产品描述

EVG®850 TB临时键合机

Features

  • Open adhesive platform
  • Various carriers (silicon, glass, sapphire, etc…)
  • Bridge tool capability for different substrate sizes
  • Available with multiple load port options and combinations
  • Recipe controlled system
  • Real time monitoring and recording of all relevant process parameters
  • Fully integrated SECS/GEM interface
  • Optional integrated inline metrology module for automated feedback loop

Technical Data

Wafer diameter (substrate size)
Up to 300 mm, oversized carrier possible
Different substrate / carrier combinations
Configuration
Coat module
Bake module with multiple hot plates
Align module with optical or mechanical alignment
Bond module
Options
Inline Metrology
ID reading
High topography wafer handling

Warped wafer handling

EVG®850 DB 解键合机

Features

  • Reliable handling of thinned, bowed and warped wafers with and without topography
  • Automated cleaning of debonded wafer
  • Recipe controlled system
  • Real time monitoring and recording of all relevant process parameters
  • Fully integrated SECS/GEM interface in automated tools
  • Bridge tool capability for different substrate sizes
  • Modular tool layout → throughput-optimized depending on specific process

Technical Data

Wafer diameter (substrate size)
Up to 300 mm
Up to 12“ film frame
Configuration
Debond module
Clean module
Film frame mounter
Options
ID reading
Various output formats
High topography wafer handling
Warped wafer handling

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